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- Technology & Innovation
Technology & Innovation
Cutting-edge Innovations
Intellectual Property
Cutting-edge Innovations
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Ji Keju and Dai Zhendong’s Team from Nanjing University of Aeronautics and Astronautics, Advanced Functional Materials: Vibration-Induced Regulation of Bioinspi
Rapid modulation of normal-direction adhesion and tangential-direction friction constitutes the fun...
Fabrication Technology of Bulb-Tipped Biomimetic Adhesive Materials via Photolithography and Thermal Reflow Process (Published in Small Methods)
Numerous climbing creatures in nature, including geckos, flies, spiders and beetles, are capable of...
Ji Keju’s Research Group from NUAA Published Work in Small: Bionic Friction Pads for High-Temperature Wafer Handling
In the semiconductor industry, continuous upgrades in dimensional precision and process complexity ...
The Company Was Approved as NUAA Project-Based Internship Base for University Students
Recently, our company has been officially approved and listed as the 2023 Project-Based Enterpri...
Research Work from Group of Ke Ju, Nanjing University of Aeronautics and Astronautics Published in ACS Applied Materials & Interfaces: Bionic Health-Monitoring
Bioelectrical signals are one of the most fundamental physiological signals of the human body. Mon...
Intellectual Property
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GB/T47233-2026 Test Method for Adhesion Property of Bionic Dry‑Adhesive Material
GB/T47233-2026 Test Method for Adhesion Property of Bionic Dry‑Adhesive Material
Quickly‑replaceable Bionic Friction‑enhancing Pad
Quickly‑replaceable Bionic Friction‑enhancing Pad ZL202520854225.7-Utility Model Patent...
Bionic Adhesive Pad for Gripping Semiconductor Components
ZL202423272579.5 -Utility Model Patent Certificate
A Bioinspired Adhesive Material With Controllable Adhesion-Detachment Performance and Its Preparation Method
A Bioinspired Adhesive Material With Controllable Adhesion-Detachment Performance and Its ...
A Mounting Structure for Bionic Adhesive Pad
A Mounting Structure for Bionic Adhesive Pad ZL 202523008493.1-Utility Model Patent Ce...
