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Biomimetic Adhesive Pad
Biomimetic Friction Pad
Psc Physical Suction Cup
APR Version
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APR Version
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Biomimetic Adhesive Pad
The product is used for repeated fixation and handling of smooth surfaces (glass, display screens, wafers, etc.) in vacuum, high temperature and other environments in the semiconductor industry, solving technical problems such as mechanical clamping being
Biomimetic Friction Pad
The product features a micro scale biomimetic microstructure array morphology and is used as a passive friction pad for semiconductor wafer handling. It can significantly improve the speed, efficiency, and stability of wafer handling, solving a common int
Psc Physical Suction Cup
Vacuum physical suction cup is the core component of ODF vacuum bonding equipment for large-sized wafers and glass substrates.
APR Version
Alignment film/resin version
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Applications
Wafer transportation and handl
APR Version
CG cover/panel coating
Wet anti-skid
Wafer End Effector with Van der Waals Adhesive Pad
Wafer Handling
Application of APR Plates in Alignment Film Production
Panel Glass Coating
Window cleaning robot
News
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