Bionic Adhesive Pads/Gecko Pad

The product is used for repeated fixation and handling of smooth surfaces (glass, display screens, wafers, etc.) in vacuum, high temperature and other environments in the semiconductor industry, solving technical problems such as mechanical clamping being

Bionic Friction Pads

The product features a micro scale biomimetic microstructure array morphology and is used as a passive friction pad for semiconductor wafer handling. It can significantly improve the speed, efficiency, and stability of wafer handling, solving a common int

PSC Physical Suction Cups

Vacuum physical suction cup is the core component of ODF vacuum bonding equipment for large-sized wafers and glass substrates.

APR Printing Plates

Alignment film/resin version

Present at CSEAC 2026 | Adhesion Fuels Indigenous Innovation for the Semiconductor Industry

From August 31 to September 2, 2026, the 14th China Semiconductor Equipment, Materials & Core Components Exhibition (CSEAC 2026) grandly took place at Wuxi Taihu International Expo Center. As a high‑tech enterprise among China’s pioneers dedicated to the R&D and manufacturing of bionic adhesion technologies for the semiconductor industry, Nanjing AidHengxin Te...

2026-09-20

Leading the Formulation & Implementation of National Standard | Ever‑Hengxin Drives High‑quality Development of the Bioinspired Dry‑adhesion Industry through St

Recently, the State Administration for Market Regulation (SAMR) and the Standardization Administration of China (SAC) have officially released the national standard GB/T 47233‑2026, Test Method for Adhesion Performance of Bioinspired Dry‑adhesive Materials. This standard shall come into force on September 1, 2026. Led and compiled by our company’s core technical team...

2026-09-01

Empowering the R&D and Manufacturing of National Key Equipment, the Team's Project Wins the First-Class Award of Shanghai Technical Invention Prize

On July 2, 2026, the winners of the 2025 Shanghai Science and Technology Awards were announced. The joint project led by the Company's core technical team, titled Key Technologies and Applications for Adhesive Capture of Non-Cooperative Targets in Space, was honored with the First Prize of the Shanghai Technical Invention Award. This achievement demonstrates the team’s in...

2026-07-03