From August 31 to September 2, 2026, the 14th China Semiconductor Equipment, Materials & Core Components Exhibition (CSEAC 2026) grandly took place at Wuxi Taihu International Expo Center. As a high‑tech enterprise among China’s pioneers dedicated to the R&D and manufacturing of bionic adhesion technologies for the semiconductor industry, Nanjing Adhesion Technology Co., Ltd. showcased its core bionic surface‑interface products and innovative wafer handling solutions at this prestigious industry event.
Within semiconductor manufacturing processes, efficient, stable and damage‑free wafer handling serves as a critical link governing product yield and advancing production automation. Addressing widespread industry pain points including wafer slippage during transfer, high breakage rates, surface mark residues and insufficient handling stability,Adhesion exhibited multiple market‑proven flagship products on‑site, such as bionic friction pads, bionic adhesion pads and physical suction cups, to precisely meet the diverse application requirements of various customers. Supported by profound technical accumulation and consistent, reliable product performance and quality, the company’s exhibits and solutions won high recognition and unanimous praise from visiting merchants.
With years of in‑depth engagement in semiconductor wafer‑transfer consumables, Adhesion consistently focuses on iterative upgrading and industrial implementation of bionic adhesion‑friction technologies, pursues indigenous innovation breakthroughs for key semiconductor consumables, keeps expanding and refining its product portfolio, and optimizes core product performance. It delivers high‑quality supporting products and dependable solutions for precision semiconductor manufacturing and damage‑free wafer transportation. This exhibition not only fully demonstrated the company’s self‑developed technological strengths, but also further enhanced its industrial influence and brand competitiveness in the semiconductor consumables sector.
Going forward, Nanjing Adhesion Technology Co., Ltd. will continue to build on independent innovation, deepen its presence in the core semiconductor consumables track, iteratively improve core products and technical solutions, strengthen R&D capabilities and industrial service capacity, and foster deeper collaborative partnerships across the industrial chain. The company will make every effort to drive domestic substitution breakthroughs in China’s semiconductor equipment and materials sector and empower high‑quality development of the semiconductor industry.
