This product is designed for repeated fixation and handling of smooth, fragile materials (glass, display panels, wafers, etc.) under high-vacuum, high-temperature and other environments across the general semiconductor industry. It resolves core technical challenges: surface scratching from mechanical clamping, residual adhesive left by chemical tapes, and operational limitations of conventional vacuum chucks. Based on van der Waals force adhesion principles, a full series of bio-inspired adhesive pads have been developed. The bionic microstructured surface design inhibits interfacial crack propagation and improves adhesion stability, while reserving interfaces for sheet separation methods such as tangential rotation and air blow-off.

For handling smooth glass products. Features: stable adhesion, no residual marking, applicable under vacuum and high-temperature environments.

It is used for handling and fixing smooth, fragile surfaces under medium-high vacuum and high-temperature environments in the general semiconductor industry. Designed with an annular structure, it supports automated production and enables separation via central pillar ejection.

It is applied inside rollable screens to increase friction of flexible supports and ensure stable conveyance of flexible displays.

It is used for handling and fixing smooth, fragile surfaces under medium-high vacuum and high-temperature environments in the general semiconductor industry. The double-sided micro-pillar array adhesive pad can completely replace double-sided tape, enabling chuck cleaning in the process. It features adjustable adhesion force, and can be designed with different adhesion strengths on each side, allowing the adhesive pad to be selectively retained on one side.

Developed based on the principle of intermolecular van der Waals forces, the tape surface features an array of microscale tip-expanded microstructures, enabling biomimetic gecko adhesion on smooth solid surfaces. The tip-expanded biomimetic adhesive structure exhibits interfacial interfacial mechanical characteristics of low preload, strong adhesion, easy detachment and reusability. Its adhesive interface is barely affected by environmental factors including air pressure, liquid media, high & low temperatures and irradiation, delivering a biomimetic solution for stable adhesion at solid interfaces.

Based on the negative pressure adsorption principle, the wafer handling vacuum suction cup evacuates air in the adsorption zone via a vacuum pump to form stable negative pressure between the suction cup and the wafer, achieving reliable fixation of wafers. The product features excellent sealing performance to sustain stable adsorption force. Meanwhile, it exhibits properties including low self-adhesion, low outgassing and mark-free contact, ensuring stable handling and smooth release of wafers, and reducing surface damage and contamination.Compatible with automated equipment such as robotic arms and wafer end effectors, it enables high-efficiency wafer handling and unmanned operation.