The FFKM friction pad is designed for anti-slip wafer transport by semiconductor robotic hands under special processes. Featuring a special structural design, it delivers high tangential friction force and low normal adhesion force to improve the speed, efficiency and stability of wafer handling. It is especially suitable for highly corrosive equipment including PVD/CVD thin-film systems, etching equipment and wet processing equipment.

This product is applied for clamping and fixing bottle bodies on automated production lines. Its curved profile fits perfectly against bottle surfaces, while the microstructured design enhances friction force. Made of wear-resistant silicone, it features long service life, protects bottle surfaces, and improves production yield rate.

These pads are used for rotational separation of bottle caps from bottle bodies on automated production lines, delivering high friction for mechanical grippers. Designed with a strip-shaped rubber structure tailored to cap textures, they efficiently unscrew caps without scratching or damaging cap surfaces. The unique granular protrusions on the contact surface reduce adhesive force of the rubber pad, enabling the bottle cap to detach quickly from the gripper after unscrewing.

The product features a functional surface with designed biomimetic microstructures to satisfy anti-slip and friction-enhancement requirements at water-containing interfaces.

This bionic friction pad is designed for wafer fixing and transportation under medium-to-high vacuum, ambient and high-temperature environments. It delivers high tangential friction force and ultra-low normal adhesion force.