Based on the principle of intermolecular van der Waals forces, the biomimetic friction pad adopts molecular-level polymer formulation and advanced micro-nano structure manufacturing technology to achieve high tangential friction and ultra-low normal adhesion in the vertical direction. Specially designed for semiconductor wafer handling and supporting applications, it is made of high-cleanliness materials compliant with semiconductor industry standards. It can work under vacuum, ambient and high-temperature conditions, ensuring reliable wafer transport and positioning.