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Applications
Wafer transportation and handl
APR Version
CG cover/panel coating
Wet anti-skid
Vacuum bonding
Filter grabbing
Gecko stickers casually
Vacuum bonding
The core components of the ODF vacuum bonding equipment for large-sized wafers and glass substrates can ensure high-precision (≤ 0.2 μ m) bonding of glass substrates in high vacuum (<0.3pa) environments
