It is a bionic friction-enhancing pad designed to fix and transfer wafers under medium & high vacuum, ambient temperature and high-temperature environments. It provides high tangential friction and normal adhesive force, improving the speed, efficiency and stability of wafer handling. It addresses the general interface control issues requiring high friction and strong adhesion in the semiconductor industry.

This bionic friction-increasing pad is designed for fixing and transferring wafers under medium & high vacuum, ambient temperature and high-temperature environments. It delivers high tangential friction force and extremely low normal adhesion force, improving the speed, efficiency and stability of wafer transportation. It addresses the universal interface control challenges featuring high friction and low adhesion within the semiconductor industry.