The vacuum physical suction cup is a core component designed for ODF vacuum bonding equipment for large-size wafers and glass substrates. It enables high-precision bonding (≤ 0.2 μm) of glass substrates under high-vacuum environments (< 0.3 Pa). It adopts pneumatic release and features a high degree of automation.

PSC physical suction cup is the core component of ODF vacuum bonding equipment for large-sized wafers and glass substrates. It can ensure high-precision (≤ 0.2 μ m) bonding of glass substrates in high vacuum (<0.3Pa) environments.

This physical suction cup is a core component for ODF vacuum bonding equipment for large-size wafers and glass substrates. It realizes high-precision bonding (≤ 0.2 μm) of glass substrates under high-vacuum environments (< 0.3 Pa).