It is a bionic friction-enhancing pad designed to fix and transfer wafers under medium & high vacuum, ambient temperature and high-temperature environments. It provides high tangential friction and normal adhesive force, improving the speed, efficiency and stability of wafer handling. It addresses the general interface control issues requiring high friction and strong adhesion in the semiconductor industry.

The core components of the ODF vacuum bonding equipment for large-sized wafers and glass substrates can ensure high-precision (≤ 0.2 μ m) bonding of glass substrates in high vacuum (<0.3pa) environments

The cylinder derivative mechanism is controlled by a cylinder control valve to control the reciprocating motion of the piston rod to achieve the insertion and contraction of microneedles. It can solve the problems of inconvenient grasping of existing mechanical grippers, weak adhesion of Bernoulli suction cups, and easy grasping of two pieces of yarn by traditional cross piercing needle suction cups, achieving a product grasping yield of 99% and replacing manual automation production.

Used for fixing products, correcting the flatness of boards, and providing convenient methods for fixing objects in daily life. Convenient for moving objects to fixed positions at any time.

Greatly improve the friction coefficient of the window cleaning and wall climbing robot on wet surfaces, effectively enhancing the adhesion and working ability of the machine on wet surfaces

Flexible printing plates dedicated to alignment film printing for liquid crystal panels

Our products are designed for repeated fixing and handling of smooth, fragile materials (glass, display panels, wafers, etc.) under medium-high vacuum and high-temperature environments across the general semiconductor industry. They resolve technical drawbacks such as surface scratches caused by mechanical clamping, adhesive residue left by chemical adhesives, and the inapplicability of conventional vacuum suction cups. Based on the Van der Waals force adhesion principle, we have developed a series of bionic adhesive pads. The bionic design of surface microstructures suppresses interfacial crack propagation and enhances adhesion stability. Meanwhile, the design supports release methods such as tangential rotation and air blow-off for wafer separation methods.

This bionic friction-increasing pad is designed for fixing and transferring wafers under medium & high vacuum, ambient temperature and high-temperature environments. It delivers high tangential friction force and extremely low normal adhesion force, improving the speed, efficiency and stability of wafer transportation. It addresses the universal interface control challenges featuring high friction and low adhesion within the semiconductor industry.