Our products are designed for repeated fixing and handling of smooth, fragile materials (glass, display panels, wafers, etc.) under medium-high vacuum and high-temperature environments across the general semiconductor industry. They resolve technical drawbacks such as surface scratches caused by mechanical clamping, adhesive residue left by chemical adhesives, and the inapplicability of conventional vacuum suction cups. Based on the Van der Waals force adhesion principle, we have developed a series of bionic adhesive pads. The bionic design of surface microstructures suppresses interfacial crack propagation and enhances adhesion stability. Meanwhile, the design supports release methods such as tangential rotation and air blow-off for wafer separation methods.