EN
Bionic Friction Enhancement Pad
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Application 
This bionic friction enhancement pad is applied for wafer fixing and transportation under vacuum, ambient and high-temperature environments. It delivers high tangential friction force and ultra-low normal adhesion force, which improves the speed, efficiency and stability of wafer handling. It addresses the general interface control challenges requiring high friction and low adhesion across various semiconductor applications.
Product Specifications
No.ItemSpecification
1ModelADSR-F15 (Normal Temperature Version) ; ADSR-HFT15 (High Temperature Version)
2Normal Adhesion Force≤ 0.15 N/cm² on wafer surface
3Dimensions

Outer Diameter Φ15 mm, Inner Diameter Φ5 mm, Thickness 0.5~2 mm (Customizable)

4Friction Coefficient

> 2 at room temperature to 100 °C; > 1.5 above 100 °C

5Operating Temperature & Service Life

Long-term: Room temperature ~ 260 ℃ (short-time peak); Service life: 1 year

6Applicable Environment

Atmospheric pressure / Vacuum; Cleanroom Class 1000 or higher

7Applicable Wafer Shapes

Circular, square, annular, etc.

8Applicable Wafer MaterialsSi, Sapphire, Glass, LiTaO₃, SiO₂
Product Features

High tangential friction force & low normal adhesion force

Easy to use, simple operation and reusable

High temperature resistance with stable performance

Leaves no residual marks and will not damage the transported surface