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FFKM Friction Pad
FFKM摩擦垫-06.jpg
Product Function
The FFKM friction pad is designed for anti-slip wafer transport by semiconductor robotic hands under special processes. Featuring a special structural design, it delivers high tangential friction force and low normal adhesion force to improve the speed, efficiency and stability of wafer handling. It is especially suitable for highly corrosive equipment including PVD/CVD thin-film systems, etching equipment and wet processing equipment.
Product specifications
No.ItemSpecification
1ModelADFR-FT4
2MaterialADFR-Polymer
3DimensionsOuter Diameter Φ8 mm, Inner Diameter Φ4 mm
4Friction Coefficient

≥4 on polished wafer surface; ≥3 on wafer surface (Ra 0.3 μm)

5Normal Adhesion Force

≤0.02 N on wafer surface

6Service Life1 year / 1,000,000 cycles *, whichever comes first
7Operating Temperature

Long-term: -40 ℃ ~ 260 ℃

8Operating PressureAtmospheric pressure or vacuum environment
9Ambient CleanlinessClass 100 or higher cleanroom
10Applicable Wafer MaterialsSSi, Glass, SiN, SiO₂, Ceramic
11Applicable Substrate ShapesCircular, square, annular, etc.