Applications
Suitable for atmospheric / vacuum, ambient / high-temperature environments to realize lift-type wafer transportation, support and fixation. It delivers extremely high tangential friction force and ultra-low normal adhesion force, improving the WPH of wafer transport equipment. It resolves common semiconductor industry challenges including wafer slipping, abrasion, particle contamination and ionic contamination.
Product Features
Standard Embedded Pad
Adhesion® Tooling-Free Products (Embedded Type) | |||
|---|---|---|---|
| Standard Grade | Base Material | ||
Round / Circular | Part Number | ADSR® | ADSR-E® (Anti-Static) |
| 6.5 mm D x 0.92 mm T | ADSR(E)-D6.5-T0.92 | O | O |
| 7.8 mm D x 1.55 mm T | ADSR(E)-D7.8-T1.55 | O | O |
| 5.3 mm D x 1.0 mm T | ADSR(E)-D5.3-T1 | O | O |
| 7.6 mm D x 1.8 mm T | ADSR(E)-D7.6-T1.8 | O | O |
| Custom designs are available beyond the listed specifications | |||
Pad Handling Guidelines
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Pad Installation Guide
Product Specifications
Adhesion® products is manufactured under strict quality control in an ultra-clean environment for the semiconductor industry.
Unpack the product in a cleanroom and handle it with clean latex gloves.
The top surface of Adhesion® features a microstructured pattern. Do not touch the top surface with sharp tools, and avoid aggressive rubbing with abrasive materials.
Adhesion® products can be cleaned with standard semiconductor wipes and most cleaning agents; electronic-grade IPA is the optimal choice.
Adhesion® products can withstand short-term exposure to 250 °C, 270 °C, or 300 °C, depending on the product grade.
Adhesion® products is compatible with UV environments.
Adhesion® products is compatible with vacuum and atmospheric environments.
Store the product together with its original packaging in a clean environment.
