详情页面 - NANJING ADHESION TECHNOLOGY CO., LTD.

Product Introduction

The wafer handling vacuum suction cup operates on the negative pressure adsorption principle. A vacuum pump evacuates air within the adsorption area to form stable negative pressure between the suction cup and the wafer, enabling reliable wafer fixation. Boasting excellent sealing performance, the product can effectively sustain adsorption force. It also features low self-adhesion, low outgassing and mark-free performance, ensuring stable conveyance and smooth release of wafers while reducing surface damage and contamination. Compatible with automated equipment including robotic arms and wafer end effectors, it enables efficient wafer handling and unmanned operation.

No.	Item	Specification
1	Size	Customized
2	Material	FKM /FFKM/ slicone
3	Mounting Method	Mechanical fixation / Adhesive backing fixation
4	Service Life	≥ 100,000 cycles
5	Operating Temperature	-40℃-300℃

No.

Item

Specification

Size

Customized

Material

FKM /FFKM/ slicone

Mounting Method

Mechanical fixation / Adhesive backing fixation

Service Life

≥ 100,000 cycles

Operating Temperature

-40℃-300℃

Application Fields

The vacuum suction cup is mounted on the end effector of wafer handling robotic arms. Combined with the negative pressure generation system, it enables secure gripping, precise positioning, translational transfer, and wafer flipping. The product meets strict high cleanliness and high reliability requirements in automated wafer handling processes, featuring ultra-low normal adhesion, low outgassing and mark-free performance.