For handling and fixing smooth, fragile surfaces under medium-high vacuum and high-temperature environments in the general semiconductor industry.
Adopts an annular structure design, compatible with automated production lines for separation via central pillar ejection.
| No. | Item | Specification |
|---|---|---|
| 1 | Model | ASFR-ACR |
| 2 | Size | Outer diameter 47 mm, Inner diameter 25 mm, Thickness 1.5 mm |
| 3 | Material | High-performance rubber |
| 4 | Hardness | 55±3 A |
| 5 | Tensile Strength | ≥5 MPa |
| 6 | Elongation | ≥250 % |
| 7 | Adhesion Force | 5 N/cm² |
| 8 | Operating Temperature | -40 ℃~70 ℃ |
