For handling and fixing smooth, fragile surfaces under medium-high vacuum and high-temperature environments in the general semiconductor industry
Adopts an annular structure design, compatible with automated production lines for separation via central pillar ejection
| No. | Item | Specification |
|---|---|---|
| 1 | Model | ASFR-ACR |
| 2 | Size (mm) | Outer diameter 47, Inner diameter 25, Thickness 1.5 |
| 3 | Material | High-performance rubber |
| 4 | Hardness (A) | 55±3 |
| 5 | Tensile Strength (MPa) | ≥5 |
| 6 | Elongation (%) | ≥250 |
| 7 | Adhesion Force (N/cm²)） | 5 |
| 8 | Operating Temperature (℃) | -40~70 |
