Suitable for handling and fixing smooth, fragile surfaces under medium-high vacuum and high-temperature environments in the general semiconductor industry.
The double-sided micro-pillar array adhesive pad can completely replace double-sided tape and support chuck cleaning in manufacturing processes.
Adhesion force is adjustable. It can be customized with different adhesion strengths on two sides, enabling the adhesive pad to be selectively retained on one side.
| No. | Item | Specification |
|---|---|---|
| 1 | Model | ADFR-DSC |
| 2 | Size | Customizable shape, thickness 0.6~1.5 mm |
| 3 | Material | High-performance rubber |
| 4 | Hardness (A) | 55±3 |
| 5 | Tensile Strength (MPa) | ≥5 |
| 6 | Elongation (%) | ≥250 |
| 7 | Adhesion Force (N/cm²) | 5 |
| 8 | Operating Temperature (℃) | -40~180 |
