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Physical Suction Cup AD-PSC-AC
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Product Introduction
The physical suction cup is a core component for ODF vacuum bonding equipment for large-size wafers and glass substrates. It enables high-precision bonding (≤ 0.2 μm) of glass substrates under high vacuum (< 0.3 Pa) environments.
Product Specification
No.ItemUnitValue

Remarks

1Material-Rubber

Polyester industrial rubber

2Service LifeCycles1,000,000-
3Flatnessμm<10μm

Measured by laser

4Adhesion ForceN15

Tested on quartz glass under 10 N preload

5Operating Temperature< 90 ℃

Adhesion force decreases as temperature rises

6Cleaning Method-IPA/Ethanol

Wipe with lint-free cloth; soaking is prohibited

Product Advantages

-

Electrostatic Adsorption Physical Adsorption

Adsorption 

Principle

Coulomb Force Intermolecular Force

Contact

 Material 

Polyimide   Microstructured Rubber

Lamination 

Precision 

Prone to center offset caused by residual static electricityExtremely stable

Adsorption 

Time

Milliseconds to seconds; affected by charging/discharging and dielectric

 polarization

Milliseconds; responds immediately upon

contact

Static Electricity 

Risk

Static electricity easily occursNo static electricity generation

Failure 

Performance 

Greatly affected by foreign contaminants, high failure rate & inconvenient replacement

Slight impact from impurities, easy to 

replace and low failure rate

Application Fields

Industries: LCD, OLED, Semiconductor

Processes: Vacuum Lamination, Vacuum Deposition, Advanced Packaging, Wafer Handling

Equipment: Vacuum Bonders, PVD Systems, CVD Systems, Packaging Equipment 

Workpieces: Glass Substrates, Silicon Wafers, Ceramics, Thin Films