This vacuum physical suction cup is a core component for ODF vacuum bonding equipment applied to large-size wafers and glass substrates. It ensures high-precision bonding
(≤ 0.2 μm) of glass substrates under high-vacuum environments (< 0.3 Pa). It uses pneumatic actuation to release the workpiece and boasts a high level of automation.
| No. | Item | Unit | Value | Remarks |
|---|---|---|---|---|
| 1 | Material | - | Rubber | Polyester industrial rubber |
| 2 | Service Life | Cycles | 1,000,000 | - |
| 3 | Flatness | μm | ＜10μm | Measured by laser |
| 4 | Adhesion | N | 25 | Tested on quartz glass under 10 N preload |
| 5 | Operating Temperature | ℃ | ＜ 90 ℃ | Adhesion force decreases as temperature rises |
| 6 | Cleaning Method | - | IPA/Ethanol | Wipe with lint-free cloth; soaking is prohibited |
Product Advantages
| - | Electrostatic Adsorption | Physical Adsorption |
|---|---|---|
| Adsorption Principle | Coulomb Force | Intermolecular Force |
| Contact Material | Polyimide | Microstructured Rubber |
| Bonding Precision | Prone to center offset cause d by residual static electricity | Extremely stable |
| Adsorption Time | Millisecond to seconds; affected by charging & discharging and dielectric polarization | Milliseconds; responds immediately upon contact |
| Static Electricity Risk | Static electricity easily occurs | Does not generate static electricity |
| Failure Performance | Greatly affected by foreign contaminants, high failure rate & inconvenient replacement | Slight impact from impurities, easy to replace and low failure rate |
Industries: LCD, OLED, Semiconductor
Processes: Vacuum Lamination, Vacuum Deposition, Advanced Packaging, Wafer Handling
Equipment: Vacuum Bonders, PVD Systems, CVD Systems, Packaging Equipment
Workpieces: Glass Substrates, Silicon Wafers, Ceramics, Thin Films
