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Physical Suction Cup AD-SFC
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Product Introduction
This vacuum physical suction cup is a core component for ODF vacuum bonding equipment applied to large-size wafers and glass substrates. It ensures high-precision bonding (≤ 0.2 μm) of glass substrates under high-vacuum environments (< 0.3 Pa). It uses pneumatic actuation to release the workpiece and boasts a high level of automation.            
Product Specification
No.ItemUnit

Value

Remarks
1Material-Rubber

Polyester industrial rubber

2Service LifeCycles1,000,000-
3Flatnessμm<10μmMeasured by laser
4AdhesionN25

Tested on quartz glass under 10 N preload

5Operating Temperature< 90 ℃

Adhesion force decreases as temperature rises

6Cleaning Method-IPA/EthanolWipe with lint-free cloth; soaking is prohibited
Product Advantages
-Electrostatic AdsorptionPhysical Adsorption
Adsorption PrincipleCoulomb Force

Intermolecular Force

Contact Material PolyimideMicrostructured Rubber
Bonding Precision

Prone to center offset cause

d by residual static electricity

Extremely stable
Adsorption Time

Millisecond to seconds; 

affected by charging & discharging and dielectric polarization

Milliseconds; responds immediately upon contact
Static Electricity RiskStatic electricity easily occurs

Does not generate static electricity

Failure Performance

Greatly affected by foreign contaminants, high failure rate & inconvenient replacement

Slight impact from impurities, easy to replace and low failure rate

Application Fields

Applicable Industries: LCD, OLED, Semiconductor (SEMICON) 

Applicable Processes: Vacuum Bonding, Vacuum Deposition, Advanced Packaging, Wafer Handling 

Applicable Equipment: Vacuum Bonders, PVD Systems, CVD Systems, Packaging Equipment 

Workpieces Handled: Glass Wafers, Silicon Wafers, Ceramics, Thin Films