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Physical Suction Cup AD-PSC-AC16
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Product Introduction
The physical suction cup is a core component for ODF vacuum bonding equipment for large-size wafers and glass substrates. It enables high-precision bonding (≤ 0.2 μm) of glass substrates under high vacuum (< 0.3 Pa) environments.            
Technical Specifications
No.ItemUnitValue

Remarks

1Material-RubberPolyester industrial rubber
2Service LifeCycles1,000,000-
3Flatnessμm<10μm

Measured by laser

4Adhesion ForceN15

Tested on quartz glass under 10 N preload

5Operating Temperature℃< 90 ℃Adhesion force decreases as temperature rises
6Cleaning Method-IPA/EthanolIPA / EthanolWipe with lint-free cloth; soaking is prohibited

Product Advantages

-

Electrostatic Adsorption

Physical Adsorption

Adsorption 

Principle

Coulomb Force 

Intermolecular Force

Contact 

Material 

Polyimide Microstructured Rubber

Lamination 

Precision 

Prone to center offset caused by residual static electricity

Extremely stable

Adsorption 

Time

 Milliseconds to seconds; affected by charging/discharging and dielectric

 polarization

Milliseconds; responds immediately upon 

contact

Static Electricity 

Risk 

Static electricity easily occurs No static electricity generation

Failure

Performance

Greatly affected by foreign contaminants, high failure 

rate & inconvenient replacement

Slight impact from impurities, easy to replace and 

low failure rate

Applications

Industries: LCD, OLED, Semiconductor

Processes: Vacuum Lamination, Vacuum Deposition, Advanced Packaging, Wafer Handling

Equipment: Vacuum Bonders, PVD Systems, CVD Systems, Packaging Equipment

Workpieces: Glass Substrates, Silicon Wafers, Ceramics, Thin Films