When wisdom drawn from nature meets industrial civilization, bionic technology has evolved into a core engine driving the leap of new quality productive forces. Anchoring market demands from a bionic perspective, Nanjing Adhesion Technology Co., Ltd. has independently developed a full portfolio of bionic surface & interface materials. These products deliver outstanding performance in the field of workpiece handling under vacuum environments for the general semiconductor industry, fully demonstrating the company’s robust hard-core technological strength.
In 2020, the research team from Nanjing University of Aeronautics and Astronautics collaborated with Kiel University, Germany, to translate gecko-inspired bionic technology from laboratory theories into market-oriented applications for the first time. The team built an industry-university-research innovation base covering nearly 10,000 square meters, established a comprehensive intellectual property system, and was equipped with top-tier R&D platforms as well as standardized clean production lines, which gave birth to the brand Adhesion. As a national high-tech enterprise, our team took the lead in formulating China’s first national standard for bionic adhesive materials, and has won dual recognition from the market and the industry via mature technologies and professional services.
Amid continuous breakthroughs in processing precision within high-end manufacturing sectors including chips and display equipment, the efficient conveyance of fragile components such as wafers and glass under harsh conditions like vacuum and high temperatures has become a bottleneck restricting industrial upgrading.
The R&D team of Adhesion carried out interdisciplinary research to tackle key challenges and conquered the core technology for micro-nano structure fabrication of high-performance rubber substrates. Its developed products including bionic adhesive pads and friction pads have resolved the difficulties of interface manipulation under extreme environments.
The breakthrough has not only broken reliance on imported core components for high-end equipment, but also filled the domestic gap in supporting consumables for semiconductor manufacturing processes. At present, these products have been delivered in batches to leading enterprises across the optoelectronics and semiconductor industries.
The team’s achievements and products have been deployed onboard China’s Mengtian Experimental Module and applied in the Shenzhou series manned spaceflight missions. Relevant technological outcomes have been featured and recommended by Focus Interview on CCTV as well as the official website of China Manned Space Program.
Inside standardized dust-free workshops, gecko tape, PSC physical suction cups, bionic adhesive pads and other products are being steadily mass-produced. These items are tailored to rigorous general semiconductor process scenarios including wafer transportation, vacuum bonding and vacuum coating.
Adhering to Adhesion’s core philosophy: Genuine engineering and technological innovation shall not only reside on academic bookshelves, but also gain solid footing on industrial shelves.
Nowadays, Adhesion is paving the way for the breakthrough of China's indigenous chips and the upgrading of high-end manufacturing relying on bionic technology. Going forward, the enterprise will keep plunging into technological innovation to embrace a brand-new future of intelligent manufacturing together with all partners.
