From September 4 to 6, 2025, the 13th China Semiconductor Equipment, Core Components & Materials Exhibition (CSEAC 2025) was grandly held at Wuxi Taihu International Expo Center. As a domestic enterprise integrating the design, R&D and production of bionic friction and adhesive materials, our company showcased our core bionic surface & interface products, innovative handling & transportation solutions and practical application cases at the exhibition (Booth No.: B3-339A).

At the exhibition, the company centered on technologies of friction pads and adhesive pads to advance the automation of semiconductor wafer transmission. To address the key pain points plaguing the semiconductor industry — slipping during wafer handling, high breakage rates and low manipulator working efficiency — we displayed our full lineup of bionic friction pads.

Verified through extensive market application, these friction pads adopt a bionic structural and material design featuring high friction and low Adhesion. They are compatible with ultra-thin and porous wafers, while customized pad thickness options are available for warped wafers. The products effectively prevent common defects during high-speed wafer conveyance, such as wafer sliding, sticking, surface imprinting and edge chipping. The serialized products are adaptable to working environments requiring vacuum conditions, high temperature resistance and electrostatic protection.

Apart from friction pads dedicated to wafer transportation, we also exhibited adhesive pads, PSC physical suction cups, APR flexible printing plates and other products. Our offerings fully cover core optoelectronic and semiconductor application scenarios, including wafer handling, vacuum bonding, LCD alignment film printing and flexible panel supporting.

Looking ahead, guided by the demands of aerospace and national defense sectors, the company will further delve into the field of surface manipulation for the general semiconductor industry. Centered on the technical requirements for damage-free, efficient and precise transportation of brittle substrates such as wafers and glass, we will evolve from domestic import substitution to international technological innovation. By developing distinctive bionic technology solutions, we will contribute to strengthening China’s chip industry and advancing the development of indigenous Chinese semiconductor chips.