The grand finals of the 8th Jiangsu Youth Innovation and Entrepreneurship Competition (sponsored under the "Science & Technology Mayor Group Cup") have recently concluded. Relying on the revolutionary project of Gecko-Inspired Adhesion Technology for General Semiconductors, Nanjing Adhesion Technology Co., Ltd. stood out from a host of top-tier entries and was awarded the Grand Prize, the highest honor of the contest.
As one of the signature events of the 2025 Nanjing Talent Day, the competition was grandly held at Nanjing Future Science and Technology City, Jiangning District, Nanjing on June 5.
Hosted jointly by the Talent Work Leading Group Office of the CPC Nanjing Municipal Committee, Nanjing Bureau of Science and Technology and Xinhua Daily Media Group, this competition boasts high specifications and extensive influence. Closely aligned with Nanjing’s blueprint for the "4266" industrial system, the contest set up ten high-end competitive tracks covering digital economy, biomedicine, new energy vehicles, integrated circuits, intelligent manufacturing equipment, advanced new materials, aerospace, future industries, artificial intelligence and modern agriculture.
After nearly half a year of fierce competition and multi-round screening, the project led by Ji Keju, the person in charge of our company, prevailed against more than 6,200 participating projects and advanced into the top 31 finalists. Ultimately, thanks to its outstanding technological innovation and broad market prospects, the project won unanimous recognition from the judging panel and claimed the sole Grand Prize of the competition.
The project titled Gecko-Inspired Adhesion Technology for General Semiconductors embodies the company’s leading edge in gecko bionics research. By investigating and mastering the adhesion and friction mechanisms of microstructures on biological toe pads, the project team constructed a mechanical model based on the van der Waals force interaction mechanism. The team proposed and tackled core key technologies for composite fabrication of large-area microstructures with complex morphologies, achieving major breakthroughs in the high-efficiency handling of general semiconductor substrates under harsh working conditions. The technology greatly fulfills the requirements for damage-free, precise and high-speed fixing and transportation of brittle base materials such as wafers, glass and ceramics.
In recent years, the team has developed a full range of bionic surface & interface products and built mass production lines, including:
· Bionic adhesive pads (Barcode: 6976093990006)
· Bionic friction pads (Barcode: 6976093990013)
· Physical suction cups (Barcode: 6976093990037)
· APR plates (Barcode: 6976093990020)
· Gecko adhesive tapes (Barcode: 6976093990044)
· Microneedle suction cups (Barcode: 6976093990051)
These products resolve technical bottlenecks in interface manipulation under vacuum, high/low temperature, vibration and other extreme environments. They are especially applicable to front-end general semiconductor manufacturing processes operated under high-temperature and vacuum conditions, such as coating, laminating and bonding procedures.
